Electrical Performance of Self-Assembly Applied to Die-to-Wafer Hybrid Bonding

• Published in: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) pp. 1 - 7
• Main Authors: Thiolon, Adele, Montmeat, Pierre, Enot, Thierry, Bond, Alice, Ladner, Carine, Sanchez, Loic, Campo, Alain, Magis, Thomas, Baudin, Floriane, Dominguez, Sebastien, Fournel, Frank, Bourjot, Emilie
• Format: Conference Proceeding
• Language: English
• Published: IEEE 11.09.2024
• Subjects: 3D Integration; Bonding; die-to-wafer; electrical test vehicle; Electrons; hybrid bonding; Kelvin; Microscopy; Self-assembly; Surface treatment; Three-dimensional displays; Throughput; Transmission electron microscopy

Self-assembly process is a promising solution to improve throughput of Die-to-Wafer direct hybrid bonding process while maintaining fine alignment. This paper presents our latest developments on self-assembly process. An electrical test vehicle has been fabricated for self-assembly with daisy-chains...