Electrical Performance of Self-Assembly Applied to Die-to-Wafer Hybrid Bonding

Self-assembly process is a promising solution to improve throughput of Die-to-Wafer direct hybrid bonding process while maintaining fine alignment. This paper presents our latest developments on self-assembly process. An electrical test vehicle has been fabricated for self-assembly with daisy-chains...

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Bibliographic Details
Published in2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) pp. 1 - 7
Main Authors Thiolon, Adele, Montmeat, Pierre, Enot, Thierry, Bond, Alice, Ladner, Carine, Sanchez, Loic, Campo, Alain, Magis, Thomas, Baudin, Floriane, Dominguez, Sebastien, Fournel, Frank, Bourjot, Emilie
Format Conference Proceeding
LanguageEnglish
Published IEEE 11.09.2024
Subjects
3D Integration
Bonding
die-to-wafer
electrical test vehicle
Electrons
hybrid bonding
Kelvin
Microscopy
Self-assembly
Surface treatment
Three-dimensional displays
Throughput
Transmission electron microscopy
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Summary:Self-assembly process is a promising solution to improve throughput of Die-to-Wafer direct hybrid bonding process while maintaining fine alignment. This paper presents our latest developments on self-assembly process. An electrical test vehicle has been fabricated for self-assembly with daisy-chains and Kelvin structures designed with 6 µm pitch and hybrid bonding pad dimensions of 3 μm. Characterizations of alignment performance, bonding quality and electrical results demonstrated the proof-of-concept of self-assembly process integration with functional hybrid bonding surfaces.
ISSN:2687-9727
DOI:10.1109/ESTC60143.2024.10712061