Multi-resolution method for thermal resistance matrix based on 2D Haar wavelet

Optimal thermal-aware design (TAD) with limited resources essentially requires the accurate thermal resistance matrix (TRM) that represents the relationship between temperature and power with proper spatial resolution. The TRM has been widely used for temperature sensor placement and floor-plan opti...

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Bibliographic Details
Published in2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) pp. 1 - 6
Main Authors Lee, Heeseok, Pak, Jun So, Joo, Kisu, Jo, Hyungyung, Kim, Heonwoo, Cho, Young-Sang
Format Conference Proceeding
LanguageEnglish
Published IEEE 28.05.2024
Subjects
Computational efficiency
Design optimization
floor-plan
hot spot
multi-resolution
Optimization
Spatial resolution
Steady-state
Systematics
Temperature sensors
Thermal resistance
Thermal resistance matrix
thermal-aware design
Thermomechanical processes
Transmission line measurements
wavelet
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Summary:Optimal thermal-aware design (TAD) with limited resources essentially requires the accurate thermal resistance matrix (TRM) that represents the relationship between temperature and power with proper spatial resolution. The TRM has been widely used for temperature sensor placement and floor-plan optimization in board and on-die design. However, the large size of TRM with fine spatial resolution usually causes the computational burden by consuming a lot of time for design optimization. In this paper, the systematic scheme that reduces the TRM size is being proposed. By using multi-resolution (MR) approach, it is presented that the size of TRM can be reduced, which can save computational resources to achieve a steady-state temperature map. By using this method, several case studies saving 70~90% of computation time are presented to demonstrate that the proposed systematic scheme is effective and useful for time efficient optimization of on-die floor-plan and temperature placement when designing SOC that include multiple heterogeneous cores.
ISSN:2694-2135
DOI:10.1109/ITherm55375.2024.10709560