Mapping of Semiconductor Electrical Properties with Terahertz Time-Domain Ellipsometry

Wafer-scale mapping of the electrical conductivity properties of a 4-inch silicon carbide (SiC) wafer using terahertz time-domain ellipsometry (THz-TDE) is demonstrated.

Saved in:
Bibliographic Details
Published in2024 49th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) pp. 1 - 2
Main Authors Agulto, Verdad C., Iwamoto, Toshiyuki, Zhao, Zixi, Liu, Shuang, Kato, Kosaku, Nakajima, Makoto
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2024
Subjects
Online AccessGet full text

Cover

Loading…
Abstract Wafer-scale mapping of the electrical conductivity properties of a 4-inch silicon carbide (SiC) wafer using terahertz time-domain ellipsometry (THz-TDE) is demonstrated.
AbstractList Wafer-scale mapping of the electrical conductivity properties of a 4-inch silicon carbide (SiC) wafer using terahertz time-domain ellipsometry (THz-TDE) is demonstrated.
Author Nakajima, Makoto
Iwamoto, Toshiyuki
Zhao, Zixi
Agulto, Verdad C.
Liu, Shuang
Kato, Kosaku
Author_xml – sequence: 1
  givenname: Verdad C.
  surname: Agulto
  fullname: Agulto, Verdad C.
  email: verdad.agulto.ile@osaka-u.ac.jp
  organization: Osaka University,Institute of Laser Engineering,Suita,Japan
– sequence: 2
  givenname: Toshiyuki
  surname: Iwamoto
  fullname: Iwamoto, Toshiyuki
  email: toshiyuki.iwamoto@pnp.co.jp
  organization: Nippo Precision, Co., Ltd
– sequence: 3
  givenname: Zixi
  surname: Zhao
  fullname: Zhao, Zixi
  email: u328472g@ecs.osaka-u.ac.jp
  organization: Osaka University,Institute of Laser Engineering,Suita,Japan
– sequence: 4
  givenname: Shuang
  surname: Liu
  fullname: Liu, Shuang
  email: u885580a@ecs.osaka-u.ac.jp
  organization: Osaka University,Institute of Laser Engineering,Suita,Japan
– sequence: 5
  givenname: Kosaku
  surname: Kato
  fullname: Kato, Kosaku
  email: katou.kousaku.ile@osaka-u.ac.jp
  organization: Osaka University,Institute of Laser Engineering,Suita,Japan
– sequence: 6
  givenname: Makoto
  surname: Nakajima
  fullname: Nakajima, Makoto
  email: nakajima.makoto.ile@osaka-u.ac.jp
  organization: Osaka University,Institute of Laser Engineering,Suita,Japan
BookMark eNqFjktLAzEURqMoWHX-gYss3M54k8zDrLVSFwPSDrosYby1VyYPkoi0v95Z6NrVgXP44LtkZ847ZOxWQCUE6Lvndd-_lcPq2IJu2kqCrCsBre66uj1hhe70vWpAdaBkfcoWUrSylKCaC1ak9Akwe1C61gv22psQyH1wv-MbtDR69_41Zh_5csIxRxrNxF-iDxgzYeLflPd8wGj2szjygSyWj94acvNgopC8xRwP1-x8Z6aExS-v2M3TcnhYlYSI2xDJmnjY_l1W_-QfCvRJMA
ContentType Conference Proceeding
DBID 6IE
6IL
CBEJK
RIE
RIL
DOI 10.1109/IRMMW-THz60956.2024.10697746
DatabaseName IEEE Electronic Library (IEL) Conference Proceedings
IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume
IEEE Xplore All Conference Proceedings
IEL
IEEE Proceedings Order Plans (POP All) 1998-Present
DatabaseTitleList
Database_xml – sequence: 1
  dbid: RIE
  name: IEL
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Applied Sciences
EISBN 9798350370324
EISSN 2162-2035
EndPage 2
ExternalDocumentID 10697746
Genre orig-research
GroupedDBID 6IE
6IF
6IL
ADZIZ
ALMA_UNASSIGNED_HOLDINGS
CBEJK
CHZPO
OCL
RIE
RIL
ID FETCH-ieee_primary_106977463
IEDL.DBID RIE
IngestDate Wed Oct 16 05:58:49 EDT 2024
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-ieee_primary_106977463
ParticipantIDs ieee_primary_10697746
PublicationCentury 2000
PublicationDate 2024-Sept.-1
PublicationDateYYYYMMDD 2024-09-01
PublicationDate_xml – month: 09
  year: 2024
  text: 2024-Sept.-1
  day: 01
PublicationDecade 2020
PublicationTitle 2024 49th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)
PublicationTitleAbbrev IRMMW-THz
PublicationYear 2024
Publisher IEEE
Publisher_xml – name: IEEE
SSID ssj0003203949
Score 3.872707
Snippet Wafer-scale mapping of the electrical conductivity properties of a 4-inch silicon carbide (SiC) wafer using terahertz time-domain ellipsometry (THz-TDE) is...
SourceID ieee
SourceType Publisher
StartPage 1
SubjectTerms Conductivity
Drude
Electronics industry
Ellipsometry
facet
Failure analysis
Graphical models
Monitoring
Nondestructive testing
Production
SiC
Silicon carbide
THz-TDS
Time-domain analysis
Title Mapping of Semiconductor Electrical Properties with Terahertz Time-Domain Ellipsometry
URI https://ieeexplore.ieee.org/document/10697746
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1NTwIxEJ0IB-PJL4wfaHrguiuyZbs9KwRNlhhF5Uba7qwxhi2B5SC_3p3ugtFo4q3pYTJp0850-t4bgFZqhE4xCjxdJBceF5x7kUyKV2tXqaCLRkSGCvrxMBw88btxd1yR1R0XBhEd-Ax9Grq__MSaJZXKihMeUroS1qAmpCzJWpuCStBpB5LLbWhVOpqXtw9x_OKNBisSVSM4Qof7axPfmqm4WNLfheHaixJC8u4vc-2b1Q-Bxn-7uQeNL9oeu98EpH3YwuwAdqs8k1WneHEIz7EiVYZXZlP2SOB4m5Hqq52znmuKQ_tGhmaEucYFo1otG2FxLRUTK0asEe_GTtVbxnruK8FOMZ9_NKDZ742uBx75OpmVMhaTtZvBEdQzm-ExMGmupAhSjWmoeYebCFXU1kkilFAUzk-g8auJ0z_mz2CHVr3EZDWhns-XeF4E8VxfuM37BCP9odw
link.rule.ids 310,311,783,787,792,793,799,27939,55088
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LT8MwDLZgSMBpPIZ4DMhh15axpq8zbCqwTggK7DYlrYsQWjNt3YH9euq0GwKBxC3KwbJkJXac7_sM0EpjV6boWYYsiguDu5wbnp8Ur1ZbCMvG2PViauiHAyd44rdDe1iR1TUXBhE1-AxNWuq__ETFc2qVFSfcoXLFWYcNmwqLkq61aqlYnbblc38TWpWS5sXNQxi-GFGwIFk1AiR0uLk08m2cis4mvToMln6UIJJ3c55LM178kGj8t6M70Pgi7rH7VUrahTXM9qBeVZqsOsezfXgOBekyvDKVskeCx6uMdF_VlHX1WByKHBmaEOoaZ4y6tSzC4mIqNhaMeCPGtRqLt4x19WeCGmM-_WhAs9eNrgKDfB1NSiGL0dJN6wBqmcrwEJgfX_qulUpMHck7PPZQeG2ZJK5wBSX0I2j8auL4j_1z2AqisD_q3wzuTmCbIlAitJpQy6dzPC1Sei7PdCA_AcjnpSk
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=2024+49th+International+Conference+on+Infrared%2C+Millimeter%2C+and+Terahertz+Waves+%28IRMMW-THz%29&rft.atitle=Mapping+of+Semiconductor+Electrical+Properties+with+Terahertz+Time-Domain+Ellipsometry&rft.au=Agulto%2C+Verdad+C.&rft.au=Iwamoto%2C+Toshiyuki&rft.au=Zhao%2C+Zixi&rft.au=Liu%2C+Shuang&rft.date=2024-09-01&rft.pub=IEEE&rft.eissn=2162-2035&rft.spage=1&rft.epage=2&rft_id=info:doi/10.1109%2FIRMMW-THz60956.2024.10697746&rft.externalDocID=10697746