A Collaborative Optimization Methodology for 2.5-D Advanced Package Considering Thermal and Power Integrity

• Published in: 2024 IEEE 7th International Conference on Electronic Information and Communication Technology (ICEICT) pp. 1281 - 1284
• Main Authors: Zhang, Peng, Wang, Da-Wei, Liu, Qiqiang, Zhao, Wen-Sheng
• Format: Conference Proceeding
• Language: English
• Published: IEEE 31.07.2024
• Subjects: 2.5-D/3-D integration; Capacitors; co-optimization; Collaboration; Electronic packaging thermal management; heuristic algorithm; Information and communication technology; Micromechanical devices; power integrity; System-on-chip; Temperature; thermal optimization
• DOI: 10.1109/ICEICT61637.2024.10671297

In this paper, a collaborative optimization methodology for 2.5-D advanced package considering thermal and power integrity is proposed. A design flow including thermally-aware placement and decoupling capacitor optimization is driven by an improved adaptive genetic algorithm. In the first stage, the methodology comprehends the critical design indexes such as the area, wirelength and temperature. Based on the determined placement, the on-chip decoupling capacitor optimization task is conducted to suppress the impedance of the cascaded power delivery network. The developed methodology provides a new paradigm of electronic design automation tools for complex 2.5-D integrated microsystem in the future.