A Collaborative Optimization Methodology for 2.5-D Advanced Package Considering Thermal and Power Integrity

In this paper, a collaborative optimization methodology for 2.5-D advanced package considering thermal and power integrity is proposed. A design flow including thermally-aware placement and decoupling capacitor optimization is driven by an improved adaptive genetic algorithm. In the first stage, the...

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Bibliographic Details
Published in2024 IEEE 7th International Conference on Electronic Information and Communication Technology (ICEICT) pp. 1281 - 1284
Main Authors Zhang, Peng, Wang, Da-Wei, Liu, Qiqiang, Zhao, Wen-Sheng
Format Conference Proceeding
LanguageEnglish
Published IEEE 31.07.2024
Subjects
2.5-D/3-D integration
Capacitors
co-optimization
Collaboration
Electronic packaging thermal management
heuristic algorithm
Information and communication technology
Micromechanical devices
power integrity
System-on-chip
Temperature
thermal optimization
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Summary:In this paper, a collaborative optimization methodology for 2.5-D advanced package considering thermal and power integrity is proposed. A design flow including thermally-aware placement and decoupling capacitor optimization is driven by an improved adaptive genetic algorithm. In the first stage, the methodology comprehends the critical design indexes such as the area, wirelength and temperature. Based on the determined placement, the on-chip decoupling capacitor optimization task is conducted to suppress the impedance of the cascaded power delivery network. The developed methodology provides a new paradigm of electronic design automation tools for complex 2.5-D integrated microsystem in the future.
ISSN:2836-7782
DOI:10.1109/ICEICT61637.2024.10671297