Design and Preparation of Ultra-Thin Conformal Shielding Coatings with Sandwich Structure for System in Packaging (SiP)

In this study, we designed and printed an ultra-thin conformal shielding coating with a sandwich structure using inkjet printing, and studied the effects of resistivity, the number of conductive layers, and the thickness and type of dielectric layers on shielding performance. The results demonstrate...

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Bibliographic Details
Published in2024 25th International Conference on Electronic Packaging Technology (ICEPT) pp. 1 - 4
Main Authors Zhang, Xuelong, Wu, Hao, Zhang, Baotan, Sun, Rong
Format Conference Proceeding
LanguageEnglish
Published IEEE 07.08.2024
Subjects
Coatings
Conductivity
Dielectrics
Electromagnetic shielding
Ink jet printing
Packaging
sandwich structure
Sandwich structures
ultra-thin coating
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Summary:In this study, we designed and printed an ultra-thin conformal shielding coating with a sandwich structure using inkjet printing, and studied the effects of resistivity, the number of conductive layers, and the thickness and type of dielectric layers on shielding performance. The results demonstrated that the shielding effectiveness of the sandwich structure coating can reach up to 95dB, which is 8-10dB greater than that of a single metallized shielding layer. At the same time, it was found that its overall thickness did not exceed 6 µm. These studies will provide a reference and basis for the design and preparation of thinner and more effective shielding coatings.
ISSN:2836-9734
DOI:10.1109/ICEPT63120.2024.10668753