UV-Curable Anisotropic Conductive Paste (ACP) for RFID Tag Packaging

• Published in: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) pp. 1 - 4
• Main Authors: Cao, Huixia, Li, Jingtian, Wang, Yong, Xu, Yadong, Lu, Xi, Hu, Yougen, Sun, Rong
• Format: Conference Proceeding
• Language: English
• Published: IEEE 07.08.2024
• Subjects: Anisotropic; anisotropic conductive paste; Curing; Electronic packaging thermal management; low-temperature packaging; Packaging; RFID; Semiconductor device measurement; Thermal resistance; UHF measurements; UV curing
• ISSN: 2836-9734
• DOI: 10.1109/ICEPT63120.2024.10668508

The hot-pressed ACP is commonly used to realize the connection between the chip and the antenna in the RFID tag packaging. However, the temperature of thermal curing process is usually too high to be suitable for some substrates that are not resistant to high temperature. Low-temperature packaging is currently one of significant challenges in RFID tags. To achieve the challenge, this work proposes an UV-curable anisotropic conductive paste to realize the packaging of RFID tags in low-temperature scenarios. We successfully demonstrate the low-temperature packaging of RFID tags using as-prepared UV-curable ACP. The morphology study indicates that the chip is bonded well on the antenna via UV-curable ACP. Importantly, the UV-curable ACP shows an excellent room-temperature storage performance, which is superior to those thermal-curable ACP. In addition, the signal of RFID tags, measured through the ultrahigh-frequency (UHF) electronic tag performance comprehensive test system is stable. The results indicate that UV-curable ACP satisfies the packaging of RFID tags in low-temperature scenarios, expands the application range of ACP, and provides a new packaging method for RFID tags.