High- Temperature Characterization of a Novel Junction Barrier Schottky Diode with Multi-Step Trenched Structure
In this paper, a Schottky diode with a new structure is introduced, and four other commercial devices with different structures are selected and compared by high-temperature static and dynamic characterization. Devices with new structures have outstanding advantages in static performance and have go...
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Published in | 2024 IEEE 7th International Electrical and Energy Conference (CIEEC) pp. 2129 - 2132 |
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Main Authors | , , , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
10.05.2024
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Subjects | |
Online Access | Get full text |
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Summary: | In this paper, a Schottky diode with a new structure is introduced, and four other commercial devices with different structures are selected and compared by high-temperature static and dynamic characterization. Devices with new structures have outstanding advantages in static performance and have good high temperature stability. |
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DOI: | 10.1109/CIEEC60922.2024.10583312 |