High- Temperature Characterization of a Novel Junction Barrier Schottky Diode with Multi-Step Trenched Structure

In this paper, a Schottky diode with a new structure is introduced, and four other commercial devices with different structures are selected and compared by high-temperature static and dynamic characterization. Devices with new structures have outstanding advantages in static performance and have go...

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Bibliographic Details
Published in2024 IEEE 7th International Electrical and Energy Conference (CIEEC) pp. 2129 - 2132
Main Authors Li, Yanqiu, Wang, Zhiqiang, Wu, Yunchan, Yu, Shenxu, Xin, Guoqing, Shi, Xiaojie
Format Conference Proceeding
LanguageEnglish
Published IEEE 10.05.2024
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Summary:In this paper, a Schottky diode with a new structure is introduced, and four other commercial devices with different structures are selected and compared by high-temperature static and dynamic characterization. Devices with new structures have outstanding advantages in static performance and have good high temperature stability.
DOI:10.1109/CIEEC60922.2024.10583312