Editorial
As we publish our second issue of the year, the IEEE Transactions on Semiconductor Manufacturing (TSM) team continues to evolve in new and interesting directions. We welcome three new members to our Steering Committee: Dr. Charles Recchia of Waters Corporation, representing the Reliability Society,...
Saved in:
| Published in | IEEE transactions on semiconductor manufacturing Vol. 36; no. 2; p. 157 |
|---|---|
| Main Author | |
| Format | Journal Article |
| Language | English |
| Published |
IEEE
01.05.2023
|
| Online Access | Get full text |
Cover
Loading…
| Summary: | As we publish our second issue of the year, the IEEE Transactions on Semiconductor Manufacturing (TSM) team continues to evolve in new and interesting directions. We welcome three new members to our Steering Committee: Dr. Charles Recchia of Waters Corporation, representing the Reliability Society, Dr. Tomasz Brozek of PDF Solutions, representing the Electron Devices Society, and Dr. Bill Nehrer, also representing the EDS. I would like to extend my sincere thanks, on behalf of the entire TSM community, to our departing Steering Committee members, Drs. John Dallesasse, Simon Deleonibus, and Steven Li. I am especially grateful to Dr. Dallesasse, long-serving Chair of the Steering Committee, for his constant support and mentoring as I learned the job of Editor-in-Chief over the last five years. Dr. Peter Magnee, representing the Solid State Circuits Council, takes over as Steering Committee Chair, and Dr. Recchia as Treasurer. |
|---|---|
| ISSN: | 0894-6507 1558-2345 |
| DOI: | 10.1109/TSM.2023.3267283 |