Mechanism Analysis and Process Optimization of Micro-Hole Lapping of Hard and Brittle Materials

Abstract: This research investigates a new micro-hole lapping method by use of the stable zirconia for the material remove model, lapping mechanism and the optimal process parameters. It is assumed that the material is removed in brittle fractures and that the impact force and friction force of a re...

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Bibliographic Details
Published inInternational Journal of Applied Science and Engineering Vol. 10; no. 3; pp. 209 - 226
Main Authors Chih-Tsong Su, Chun-Kuo Liu, K. N. Lie
Format Journal Article
LanguageChinese
Published 台灣 朝陽科技大學理工學院 01.09.2012
Subjects
hard and brittle material
Micro-hole lapping
response surface method
Scopus
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Summary:Abstract: This research investigates a new micro-hole lapping method by use of the stable zirconia for the material remove model, lapping mechanism and the optimal process parameters. It is assumed that the material is removed in brittle fractures and that the impact force and friction force of a reciprocated piano wire are considered as the major mechanism for removing material. An empirical material remove model including parameters of abrasive size, abrasive concentration of slurry, taper angle of wire, wire tension and pH-value of slurry is derived. The design of experiment and the regression analysis are conducted to formulate the empirical correlation between the significant parameters and the material remove rate. The results show that both the empirical and theoretical models have good agreements with the experimental results and that the material remove rate increases with the abrasive size, wire tension and pH-value of slurry while the material remove rate decreases as the concentration of abrasive
ISSN:1727-2394