The Effect of Obliquely Sputtered Cu Underlayers with Different Thicknesses on the Magnetic Properties of 50 nm Ni[sub.80]Fe[sub.20] Thin Films

The magnetic properties of 50 nm Ni[sub.80] Fe[sub.20] deposited on Cu underlayers with different thicknesses by obliquely sputtering were studied. It was found that the in-plane uniaxial magnetic anisotropy (IPUMA) of the Ni[sub.80] Fe[sub.20] film can be induced by the obliquely sputtered Cu under...

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Published inMagnetochemistry Vol. 8; no. 10
Main Authors Li, Xiaoyu, Jiang, Yunshi, Yan, Huan, Li, Tianming, Zhang, Lu, Zhang, Zhihong, Guan, Xian, Chen, Min, Wang, Jiaoyin, Pu, Yihan, Peng, Genzhai, Wang, Mengjia
Format Journal Article
LanguageEnglish
Published MDPI AG 01.10.2022
Subjects
Copper
Dielectric films
Identification and classification
Iron compounds
Magnetic properties
Measurement
Nickel compounds
Thin films
China
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Summary:The magnetic properties of 50 nm Ni[sub.80] Fe[sub.20] deposited on Cu underlayers with different thicknesses by obliquely sputtering were studied. It was found that the in-plane uniaxial magnetic anisotropy (IPUMA) of the Ni[sub.80] Fe[sub.20] film can be induced by the obliquely sputtered Cu underlayer deposited under the NiFe layer. The IPUMA field of NiFe film varies between 20 Oe and 40 Oe when the thickness of Cu underlayer varies from 5 nm to 50 nm. The permeability spectrum results show that the damping factor increases with increasing Cu underlayer thickness. This indicates that changing the thickness of the Cu underlayer of obliquely sputtering is an effective method to adjust the damping factor in the dynamic magnetization process of Ni[sub.80] Fe[sub.20] thin films.
ISSN:2312-7481
2312-7481
DOI:10.3390/magnetochemistry8100134