ADMITTANCE OF MIS-STRUCTURES BASED ON HgCdTe WITH A DOUBLE-LAYER CdTe/[Al.sub.2][O.sub.3] INSULATOR

Admittance of MIS structures based on n(p)- [Hg.sub.1-x][Cd.sub.x]Te (at x from 0.22 to 0.40) with Si[O.sub.2]/[Si.sub.3][N.sub.4], [Al.sub.2][O.sub.3], and CdTe/[Al.sub.2][O.sub.3] insulators is studied experimentally at 77 K. Growth of an intermediate CdTe layer during epitaxy results in the almos...

Full description

Saved in:
Bibliographic Details
Published inRussian physics journal Vol. 60; no. 11; p. 1853
Main Authors Dzyadukh, S.M, Voitsekhovskii, A.V, Nesmelov, S.N, Sidorov, G.Yu, Varavin, V.S, Vasil'ev, V.V, Dvoretsky, S.A, Mikhailov, N.N, Yakushev, M.V
Format Journal Article
LanguageEnglish
Published Springer 01.03.2018
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Admittance of MIS structures based on n(p)- [Hg.sub.1-x][Cd.sub.x]Te (at x from 0.22 to 0.40) with Si[O.sub.2]/[Si.sub.3][N.sub.4], [Al.sub.2][O.sub.3], and CdTe/[Al.sub.2][O.sub.3] insulators is studied experimentally at 77 K. Growth of an intermediate CdTe layer during epitaxy results in the almost complete disappearance of the hysteresis of electrophysical characteristics of MIS structures based on graded-gap n-HgCdTe for a small range of the voltage variation. For a wide range of the voltage variation, the hysteresis of the capacitance-voltage characteristics appears for MIS structures based on n-HgCdTe with the CdTe/[Al.sub.2][O.sub.3] insulator. However, the hysteresis mechanism differs from that in case of a single-layer [Al.sub.2][O.sub.3] insulator. For MIS structures based on p-HgCdTe, introduction of an additional CdTe layer does not lead to a significant decrease of the hysteresis phenomena, which may be due to the degradation of the interface properties when mercury leaves the film as a result of low-temperature annealing changing the conductivity type of the semiconductor. Keywords: HgCdTe, molecular-beam epitaxy, passivation coating, interface, CdTe, graded-gap layer, capacitance-voltage characteristic.
ISSN:1064-8887
1573-9228
DOI:10.1007/s11182-018-1294-9