FILLER-CONTAINING MOLDING COMPOSITION AND PROCESS FOR ITS MANUFACTURE

In filler-containing molding compositions a very good compatibility between the hydrophilic filler and the hydrophobic polymer matrix is obtained by using as adhesion promotor alkali metal salts of alkyl or alkylene-sulfonic acids or alkyl sulfates, the derivatives thereof and the acids on which the...

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Bibliographic Details
Main Authors SPANKEREN U, LUEDERS W, BURG K, HERWIG W
Format Patent
LanguageEnglish
Published 29.04.1981
Edition3
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
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Summary:In filler-containing molding compositions a very good compatibility between the hydrophilic filler and the hydrophobic polymer matrix is obtained by using as adhesion promotor alkali metal salts of alkyl or alkylene-sulfonic acids or alkyl sulfates, the derivatives thereof and the acids on which the salts are based. The flow properties of the molding compositions and the mechanical properties of the shaped articles made therefrom are improved.
Bibliography:Application Number: ZA19800001498