ULTRA-HARD MATERIAL CUTTING ELEMENTS AND METHODS OF MANUFACTURING THE SAME WITH A METAL-RICH INTERMEDIATE LAYER

Methods for joining an ultra-hard body, such as a thermally stable polycrystalline diamond (TSP) body, to a substrate and mitigating the formation of high stress concentration regions between the ultra-hard body and the substrate. One method includes covering at least a portion of the ultra-hard bod...

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Bibliographic Details
Main Authors BELNAP, John, ZHAO, Liang, GAN, Xiaoge, BURHAM, Yuri, LIN, Zhijun, BAO, Yahua, ZHANG, Youhe
Format Patent
LanguageEnglish
Published 28.04.2021
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Summary:Methods for joining an ultra-hard body, such as a thermally stable polycrystalline diamond (TSP) body, to a substrate and mitigating the formation of high stress concentration regions between the ultra-hard body and the substrate. One method includes covering at least a portion of the ultra-hard body with an intermediate layer, placing the ultra-hard body and the intermediate layer in a mold, filling a remaining portion of mold with a substrate material including a matrix material and a binder material such that the intermediate layer is disposed between the ultra-hard body and the substrate material, and heating the mold to an infiltration temperature configured to melt the binder material and form the substrate.
Bibliography:Application Number: ZA20170003847