SOLID PCD CUTTER

A method of forming a cutting element may include placing a plurality of diamond particles adjacent to a substrate in a reaction cell; and subjecting the plurality of diamond particles to high pressure high temperature conditions to form a polycrystalline diamond body; wherein the polycrystalline di...

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Bibliographic Details
Main Authors YURI BURHAN, YOUHE ZHANG, RONALD K EYRE, JIBIN SHI, YUELIN SHEN, DANIEL J BELNAP
Format Patent
LanguageEnglish
Published 27.09.2023
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Summary:A method of forming a cutting element may include placing a plurality of diamond particles adjacent to a substrate in a reaction cell; and subjecting the plurality of diamond particles to high pressure high temperature conditions to form a polycrystalline diamond body; wherein the polycrystalline diamond body comprises a cutting face area to thickness ratio ranging from 60:16 to 500:5; and wherein the polycrystalline diamond body has at least one dimension greater than 8 mm.
Bibliography:Application Number: ZA20140004420