Sealing layer resin compositions

A polypropylene resin composition includes a random copolymer of propylene, at least one C4-C10 alpha-olefin, and ethylene, wherein the ratio of the weight percentage of ethylene in the polypropylene random copolymer relative to the sum of the weight percentages of the C4-C10 alpha-olefins is less t...

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Bibliographic Details
Main Authors PEZZUTTI, JOSE, LUIS, SCHOENE, WERNER, NICOLINI, JOSE, LUIS, MAIER, RALPH-DIETER, GALIATSATOS, VASSILIOS
Format Patent
LanguageEnglish
Published 28.11.2007
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
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Summary:A polypropylene resin composition includes a random copolymer of propylene, at least one C4-C10 alpha-olefin, and ethylene, wherein the ratio of the weight percentage of ethylene in the polypropylene random copolymer relative to the sum of the weight percentages of the C4-C10 alpha-olefins is less than or equal to 1, and, from 10 to 20,000 ppm of at least one nucleating agent.
Bibliography:Application Number: ZA20060005197