COOLING SYSTEM FOR SEMICONDUCTOR DIE CARRIER

A cooling system for a die carrier includes a cooling fan (742) disposed at a substantial distance from the semiconductor die carrier and a cooling duct (744) including an inlet portion (752) and an outlet portion (754). The cooling duct inlet portion (752) is attached to the cooling fan (742) and a...

Full description

Saved in:
Bibliographic Details
Main Authors BEHAR, MOISES, DUTTA, ARINDUM, CRANE, STANFORD, W., JR, KRISHNAPURA, LAKSHMINARASIMHA, LINK, KEVIN, J, AHERN, WILLIAM
Format Patent
LanguageEnglish
French
Published 01.07.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A cooling system for a die carrier includes a cooling fan (742) disposed at a substantial distance from the semiconductor die carrier and a cooling duct (744) including an inlet portion (752) and an outlet portion (754). The cooling duct inlet portion (752) is attached to the cooling fan (742) and a heat exchanger (746) is disposed on an upper surface of the semiconductor die carrier (730). The cooling duct outlet portion (754) is disposed in close proximity to the heat exchanger (746) such that the cooling fan (742) draws ambient air into the cooling duct (744) and the ambient air exists the cooling duct outlet portion (754) and passes in a heat exchanger relationship with the heat exchanger (746). L'invention concerne un système de refroidissement destiné à un porte-puce (740), ledit système comportant un ventilateur (742), un conduit de refroidissement (744) et un échangeur thermique (746).
Bibliography:Application Number: WO1998US24251