SOLDERING COMPOSITION
The inventive soldering compositions all contain a tin-silver-copper base. To this base are added varying combinations of indium, antimony, zinc and/or bismuth to form soldering compositions having the desirable properties described herein. Also disclosed are methods of soldering employing the compo...
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Main Authors | , |
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Format | Patent |
Language | English French |
Published |
13.03.1997
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | The inventive soldering compositions all contain a tin-silver-copper base. To this base are added varying combinations of indium, antimony, zinc and/or bismuth to form soldering compositions having the desirable properties described herein. Also disclosed are methods of soldering employing the compositions.
Les compositions décrites contiennent toutes une base étain-argent-cuivre. A cette base sont ajoutées des combinaisons variables d'indium, d'antimoine, de zinc et/ou de bismuth pour former des compositions de brasage présentant les propriétés recherchées. Sont également décrits des procédés de brasage à l'aide de ces compositions. |
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Bibliography: | Application Number: WO1996US13720 |