METHOD AND APPARATUS FOR THE PLANARIZATION OF LAYERS ON SEMICONDUCTOR SUBSTRATES

A semiconductor wafer (10) is provided with a planarization layer (14) which has its exposed surface (20) flatten by being engaged with a flat surface (19) on an anvil (16), which may be temporarily supported on the layer (14). Une plaquette de semi-conducteurs (10) est revêtue d'une couche (14...

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Bibliographic Details
Main Author DOBSON, CHRISTOPHER, DAVID
Format Patent
LanguageEnglish
French
Published 27.04.1995
Edition6
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:A semiconductor wafer (10) is provided with a planarization layer (14) which has its exposed surface (20) flatten by being engaged with a flat surface (19) on an anvil (16), which may be temporarily supported on the layer (14). Une plaquette de semi-conducteurs (10) est revêtue d'une couche (14) dont on aplanit la surface exposée (20) en l'engageant sous la surface plane (19) d'une enclume (16), laquelle peut être temporairement appliquée sur la couche (14).
Bibliography:Application Number: WO1994GB02326