METHOD AND APPARATUS FOR THE PLANARIZATION OF LAYERS ON SEMICONDUCTOR SUBSTRATES
A semiconductor wafer (10) is provided with a planarization layer (14) which has its exposed surface (20) flatten by being engaged with a flat surface (19) on an anvil (16), which may be temporarily supported on the layer (14). Une plaquette de semi-conducteurs (10) est revêtue d'une couche (14...
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Main Author | |
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Format | Patent |
Language | English French |
Published |
27.04.1995
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor wafer (10) is provided with a planarization layer (14) which has its exposed surface (20) flatten by being engaged with a flat surface (19) on an anvil (16), which may be temporarily supported on the layer (14).
Une plaquette de semi-conducteurs (10) est revêtue d'une couche (14) dont on aplanit la surface exposée (20) en l'engageant sous la surface plane (19) d'une enclume (16), laquelle peut être temporairement appliquée sur la couche (14). |
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Bibliography: | Application Number: WO1994GB02326 |