ELECTRONIC COMPONENT

• Main Authors: KATOH, IKUO, ISHIHARA, SUSUMU, SUGAWARA, YUUICHI, SUZUKI, YOSHIHISA
• Format: Patent
• Language: English; French; Japanese
• Published: 03.03.1994
• Edition: 5
• Subjects: BASIC ELECTRONIC CIRCUITRY; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; DEAF-AID SETS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; PUBLIC ADDRESS SYSTEMS; RESONATORS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE

An electronic component device (A1) has a lead electrode at the edge thereof. A support member (A2) is opposed to the electronic component device with a gap (G) between them, and has an external connection terminal (A5) at the position opposing a lead electrode (A4). A resin layer (A3) is disposed between the electronic component device (A1) and the support member (A2) and is spaced apart by a distance (d) from the edge of the electronic component (A1). The resin layer (A3) bonds the electronic component device (A1) to the support member (A2). The distance (d) satisfies the relation G < d. A conductive agent (A6) is filled into the gap (G) between the lead electrode (A4) and the external connection terminal (A5) and into the space defined between the resin layer (A3) and the edge of the electronic component device (A1) having the distance d, and connects the lead (A4) to the external connection terminal (A5). When an electronic component is fitted to a printed board, inferior connection between the lead electrode and the external connection terminal does not occur. Un composant électronique (A1) est pourvu d'une électrode de sortie sur sa tranche. Un élément de support (A2) est placé vis-à-vis du composant électronique, un espace (G) étant laissé libre entre le composant et ledit élément de support (A2) qui possède une borne de raccordement extérieure (A5) placée vis-à-vis de l'électrode de sortie (A4). Une couche de résine (A3) est placée entre le composant électronique (A1) et l'élément de support (A2), à une certaine distance (d) du bord du composant électronique (A1). La couche de résine (A3) fait adhérer le composant électronique (A1) à l'élément de support (A2), la distance d étant plus grande que G. Un agent conducteur (A6) remplit l'espace (G) séparant l'électrode de sortie (A4) de la borne de raccordement extérieure (A5) ainsi que l'espace compris entre la couche de résine (A3) et le bord du composant électronique (A1), ledit espace correspondant à la distance d. L'agent conducteur (A6) relie ainsi l'électrode de sortie (A4) à la borne de raccordement extérieure (A5). Lorsqu'un composant électronique est monté sur une carte à circuits imprimés, aucune connexion inférieure ne se fait entre l'électrode et la borne de raccordement extérieure.