METHOD OF BRAZING

• Main Author: DAIKUZONO, NORIO
• Format: Patent
• Language: English; Japanese
• Published: 22.07.1993
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CURRENT COLLECTORS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A method of joining electronic parts to each other by brazing. When a member to be joined is joined to a base material by brazing while projecting a laser beam on them, the laser beam is projected on a probe capable of transmitting laser light, and is emitted from its end part, and further, the pointed end part is contacted substantially with solder or the member to be joined. L'invention se rapporte à un procédé pour joindre des pièces électroniques entre elles par brasage. A cet effet, au moment où l'on joint un élément à assembler à un matériau de base par brasage, tout en projetant un faisceau laser sur l'élément à assembler et sur le matériau de base, on projette ledit faisceau laser d'abord sur une sonde capable de transmettre la lumière laser et le faisceau laser est émis depuis la partie terminale de la sonde, la partie terminale pointue étant en outre mise en contact essentiellement avec la soudure ou avec l'élément à assembler.