CONDUCTIVE PASTE COMPOSITION AND CURING THEREOF

• Main Authors: ISHIMURA, HIDEKAZU, OTSUKA, MASAHIKO, MASUI, YUJI
• Format: Patent
• Language: English; Japanese
• Published: 09.08.1990
• Subjects: ADHESIVES; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; INKS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING; USE OF MATERIALS THEREFOR; WOODSTAINS

Un procédé sert à durcir un revêtement formé d'une composition conductive pâteuse composée d'une fine poudre conductive et d'une résine durcissable sous l'effet de faisceaux d'électrons ou par chauffage. Composition conductive pâteuse de mise en oeuvre de ce procédé.