PROCESS FOR ENCAPSULATING MICROELECTRONIC CIRCUITS WITH ORGANIC COMPONENTS

• Main Author: MOELLER, WERNER
• Format: Patent
• Language: English; German
• Published: 22.05.1986
• Edition: 4
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Incorporation of special absorbers (getters) in hermetically sealed electronic circuits with organic components for example with parylene passivation, silver conductive adhesive and sealing materials. The getter material, preferably BaAl4 is dispersed as an extremely fine-grained powder in a gas-per...