SEMICONDUCTOR PACKAGING STRUCTURE AND PACKAGING METHOD

• Main Authors: HUA, Fay, JIN, Youngjin
• Format: Patent
• Language: Chinese; English; French
• Published: 17.10.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Provided in the present invention are a semiconductor packaging structure and a packaging method. The packaging structure comprises a plurality of semiconductor devices fixed on a circuit board, at least two of the semiconductor devices having different heights; and a heat dissipation metal layer, which is provided with parts in contact with the semiconductor devices. The heat dissipation metal layer is further provided with a connecting portion, which is arranged corresponding to the gap between the semiconductor devices. The parts of the heat dissipation metal layer in contact with the semiconductor devices have the same thickness, and the parts of the heat dissipation metal layer in contact with the semiconductor devices and the connecting portion are arranged in a continuous manner. The connecting portion comprises a first step structure with varying heights, the first step structure being arranged corresponding to the different heights of the semiconductor devices. The present invention maintains a unifo