RESIN COMPOSITION, DIAMINE COMPOUND, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

• Main Authors: OGAWA Michihiro, NOZAKI Atsuyasu
• Format: Patent
• Language: English; French; Japanese
• Published: 03.10.2024
• Subjects: ACYCLIC OR CARBOCYCLIC COMPOUNDS; APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

The present invention provides a resin composition containing: a resin that includes a specific repeating unit, has a group including an ethylenically unsaturated bond, and has a phenolic hydroxyl group content of 0.250 mmol/g or less; and a polymerizable compound that has an ethylenically unsaturated bond. The present invention also provides a cured product obtained by curing the resin composition, a multilayer body containing the cured product, a method for producing the cured product, a method for producing the multilayer body, a method for producing a semiconductor device involving the method for producing the cured product, a semiconductor device containing the cured product, and a diamine compound having a specific structure. La présente invention concerne une composition de résine contenant : une résine qui comprend une unité de répétition spécifique, a un groupe comprenant une liaison éthyléniquement insaturée, et a une teneur en groupe hydroxyle phénolique de 0,250 mmol/g ou moins ; et un composé polymérisable qui a une liaison éthyléniquement insaturée. La présente invention concerne également un produit durci obtenu par durcissement de la composition de résine, un corps multicouche contenant le produit durci, un procédé de production du produit durci, un procédé de production du corps multicouche, un procédé de production d'un dispositif semi-conducteur impliquant le procédé de production du produit durci, un dispositif semi-conducteur contenant le produit durci, et un composé diamine ayant une structure spécifique. 特定の繰り返し単位を含み、エチレン性不飽和結合を有する基を含み、フェノール性水酸基の含有量が０．２５０mmol/g以下である樹脂、及び、エチレン性不飽和結合を有する重合性化合物を含む樹脂組成物、上記樹脂組成物を硬化してなる硬化物、硬化物を含む積層体、上記硬化物の製造方法、積層体の製造方法、硬化物の製造方法を含む半導体デバイスの製造方法、及び、硬化物を含む半導体デバイス、また、特定構造のジアミン化合物。