INTERPOSER AND CIRCUIT MODULE

• Main Author: OTSUBO Yoshihito
• Format: Patent
• Language: English; French; Japanese
• Published: 03.10.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

This interposer comprises a body and one or more connection conductors. The body has an upper main surface and a lower main surface. When viewed downward, the body has a shape surrounding a first region, and has an inner edge and an outer edge. When viewed downward, the body has spaces extending fro...