DUAL CURABLE ADHESIVE COMPOSITION

• Main Authors: CHOI, Kuhn Sukhoon, CHOI, Kwangho, SEO, Ys Yongseong, PARK, Hyeongpil
• Format: Patent
• Language: English; French
• Published: 03.10.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

The present invention relates to a dual curable adhesive composition comprising a) a polyurethane resin having a molecular weight of from 1000 to 1000000 Da; b) an urethane diacrylate oligomer having a molecular weight of from 1000 to 100000 Da c) a photoinitiator; d) two or more monofunctional (meth)acrylate monomers; and e) core shell particles. The composition has an improved impact resistance at low temperatures (below 0 °C). La présente invention concerne une composition adhésive durcissable double comprenant a) une résine de polyuréthane ayant un poids moléculaire de 1000 à 1000000 Da ; b) un oligomère de diacrylate d'uréthane ayant un poids moléculaire de 1000 à 100000 Da ; c) un photoinitiateur ; d) deux monomères de (méth)acrylate monofonctionnel ou plus ; et e) des particules d'enveloppe de noyau. La composition présente une résistance aux chocs améliorée à basses températures (inférieure à 0 °C).