CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRCUIT BOARD

• Main Authors: LIU, Yingwei, LU, Xinhong, LI, Baoman, CUI, Zhao, LI, Guoteng, LI, Liuqing, ZHOU, Jingshang, DONG, Shuilang
• Format: Patent
• Language: Chinese; English; French
• Published: 26.09.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

Provided in the embodiments of the present disclosure are a circuit board, a display apparatus, and a manufacturing method for a circuit board. The manufacturing method for a circuit board comprises: providing a precursor substrate; forming a seed pattern and an auxiliary seed pattern on a side of the precursor substrate, wherein the seed pattern is located in a pattern area, the auxiliary seed pattern is located in a non-pattern area, and the seed pattern and the auxiliary seed pattern are spaced apart from each other; and by means of an electroplating process, forming a bonding pad at the seed pattern and forming an auxiliary pattern at the auxiliary seed pattern. Les modes de réalisation de la présente divulgation concernent une carte de circuit imprimé, un appareil d'affichage et un procédé de fabrication d'une carte de circuit imprimé. Le procédé de fabrication d'une carte de circuit imprimé comprend : la fourniture d'un substrat précurseur ; la formation d'un motif de germination et d'un motif de germin