WIRING DEVICE AND WIRING DEVICE MANUFACTURING METHOD

• Main Authors: ARITSUKA Yuki, KUDO Hiroshi
• Format: Patent
• Language: English; French; Japanese
• Published: 19.09.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

This wiring device comprises: a base layer including a first surface and a second surface positioned on the opposite side to the first surface; a plurality of first wirings positioned on the first surface of the base layer; and a first organic layer covering the plurality of first wirings. The first...