WIRING DEVICE AND WIRING DEVICE MANUFACTURING METHOD

This wiring device comprises: a base layer including a first surface and a second surface positioned on the opposite side to the first surface; a plurality of first wirings positioned on the first surface of the base layer; and a first organic layer covering the plurality of first wirings. The first...

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Bibliographic Details
Main Authors ARITSUKA Yuki, KUDO Hiroshi
Format Patent
LanguageEnglish
French
Japanese
Published 19.09.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:This wiring device comprises: a base layer including a first surface and a second surface positioned on the opposite side to the first surface; a plurality of first wirings positioned on the first surface of the base layer; and a first organic layer covering the plurality of first wirings. The first wirings have an aspect ratio of 2.0 to 4.0, inclusive. Ce dispositif de câblage comprend : une couche de base comprenant une première surface et une seconde surface positionnée sur le côté opposé à la première surface ; une pluralité de premiers câblages positionnés sur la première surface de la couche de base ; et une première couche organique recouvrant la pluralité de premiers câblages. Les premiers câblages ont un rapport d'aspect de 2,0 à 4,0, inclus. 配線デバイスは、第１面及び第１面の反対側に位置する第２面を含む下地層と、下地層の第１面上に位置する複数の第１配線と、複数の第１配線を覆う第１有機層と、を備える。第１配線は、２．０以上４．０以下のアスペクト比を有する。
Bibliography:Application Number: WO2024JP09812