COPPER MICROPARTICLE DISPERSION

• Main Authors: FUKUDA Taiki, EYAMA Takaaki, INAYA Shuichi, SUZUKI Ukyo, NAKAGAWA Haruka
• Format: Patent
• Language: English; French; Japanese
• Published: 19.09.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASTING; CONDUCTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; PERFORMING OPERATIONS; POWDER METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; TRANSPORTING; WORKING METALLIC POWDER

The present invention relates to a copper microparticulate dispersion containing copper nanoparticles A, a modified cellulose B, and a dispersion medium C, wherein: the average particle diameter of the copper nanoparticles A is 50 nm to 350 nm; the content of the modified cellulose B in the copper m...