THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE MANUFACTURED USING SAME

The present invention relates to a thermoplastic resin composition comprising, relative to 100 parts by weight of a base resin containing (A) 50 to 70 wt% of a polycarbonate resin, (B) 10 to 30 wt% of a polysiloxane-polycarbonate copolymer resin, and (C) 10 to 20 wt% of a polybutylene terephthalate...

Full description

Saved in:
Bibliographic Details
Main Authors RYOO, Heekyoung, KIM, In-Chol, CHU, Donghui
Format Patent
LanguageEnglish
French
Korean
Published 29.08.2024
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:The present invention relates to a thermoplastic resin composition comprising, relative to 100 parts by weight of a base resin containing (A) 50 to 70 wt% of a polycarbonate resin, (B) 10 to 30 wt% of a polysiloxane-polycarbonate copolymer resin, and (C) 10 to 20 wt% of a polybutylene terephthalate resin, (D) 1 to 3 parts by weight of siloxane modified polyester, (E) 1 to 3 parts by weight of syndiotactic polystyrene, and (F) 0.5 to 2 parts by weight of a benzotriazole-based ultraviolet stabilizer. La présente invention concerne une composition de résine thermoplastique comprenant, par rapport à 100 parties en poids d'une résine de base contenant (A) 50 à 70 % en poids d'une résine de polycarbonate, (B) 10 à 30 % en poids d'une résine de copolymère polysiloxane-polycarbonate, et (C) 10 à 20 % en poids d'une résine de poly(téréphtalate de butylène), (D) 1 à 3 parties en poids de polyester modifié par siloxane, (E) 1 à 3 parties en poids de polystyrène syndiotactique, et (F) 0,5 à 2 parties en poids d'un stabilisant ultraviolet à base de benzotriazole. (A) 폴리카보네이트 수지 50 내지 70 중량%; (B) 폴리실록산-폴리카보네이트 공중합체 수지 10 내지 30 중량%; 및 (C) 폴리부틸렌 테레프탈레이트 수지 10 내지 20 중량%를 포함하는 기초 수지 100 중량부에 대하여, (D) 실록산 변성 폴리에스테르 1 내지 3 중량부; (E) 신디오탁틱 폴리스티렌 1 내지 3 중량부; 및 (F) 벤조트리아졸계 자외선 안정제 0.5 내지 2 중량부를 포함하는 열가소성 수지 조성물에 관한 것이다.
Bibliography:Application Number: WO2024KR95130