SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

• Main Authors: TSUKAHARA Ryuta, ZHANG Song, YASUDA Shuichi, TANAKA Tomoya, IWASAKI Akihisa
• Format: Patent
• Language: English; French; Japanese
• Published: 08.08.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

This substrate processing apparatus comprises a first substrate holding unit (2), at least one nozzle (3), a mixing unit (30), a liquid feeding pipe (42), and a control unit (90). The nozzle (3) is for discharging therethrough a processing liquid to a main surface of a substrate (W) held by the firs...