PLATE ASSEMBLIES, PROCESS KITS, AND PROCESSING CHAMBERS FOR SEMICONDUCTOR MANUFACTURING

Embodiments of the present disclosure relate to plate assemblies, process kits, processing chambers, and related components and methods for semiconductor manufacturing. In one implementation, a plate assembly for disposition in a processing chamber includes an inner section that includes an opaque m...

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Bibliographic Details
Main Authors MORADIAN, Ala, SUBBANNA, Manjunath
Format Patent
LanguageEnglish
French
Published 02.08.2024
Subjects
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