ELECTRODEPOSITION OF THIN COPPER FILMS ON CONDUCTIVE SUBSTRATES

A copper electrolyte comprising (a) a water soluble copper salt; (b) a complexant; (c) a leveler; (d) optionally a polar solvent; (e) optionally, a pH adjuster; and (f) balance water. The copper electrolyte has a pH in the range of about 8 to about 11, preferably about 8.2 to about 9.5. The copper e...

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Bibliographic Details
Main Authors WHITTEN, Kyle, NAJJAR, Elie
Format Patent
LanguageEnglish
French
Published 25.07.2024
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Summary:A copper electrolyte comprising (a) a water soluble copper salt; (b) a complexant; (c) a leveler; (d) optionally a polar solvent; (e) optionally, a pH adjuster; and (f) balance water. The copper electrolyte has a pH in the range of about 8 to about 11, preferably about 8.2 to about 9.5. The copper electrolyte can be used to deposit an ultrathin copper layer on a conductive substrate that is free of pinholes and other defects and that suppresses metal dissolution. L'invention concerne un électrolyte de cuivre comprenant (a) un sel de cuivre soluble dans l'eau ; (b) un complexant ; (c) un niveleur ; (d) éventuellement un solvant polaire ; (e) éventuellement, un ajusteur de pH ; et (f) un complément d'eau. L'électrolyte de cuivre présente un pH situé dans la plage allant d'environ 8 à environ 11, de préférence d'environ 8,2 à environ 9,5. L'électrolyte de cuivre peut être utilisé pour déposer une couche de cuivre ultramince, sur un substrat conducteur, qui est exempte de piqûres et autres défauts et qui empêche la dissolution du métal.
Bibliography:Application Number: WO2024US11616