FLEXIBLE CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE INCLUDING SAME

• Main Authors: PARK, Ji Hyo, CHAE, Sung Min, YOON, Hyung Kyu
• Format: Patent
• Language: English; French; Korean
• Published: 04.07.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

A flexible circuit board according to an embodiment comprises: a substrate including a first surface and a second surface opposite to the first surface; a first circuit pattern and a second circuit pattern arranged on the first surface; and a metal pattern arranged on the second surface, wherein the second surface includes a plurality of first regions and a plurality of second regions, a first pattern is arranged in the first regions, a second pattern is arranged in the second regions, and the area of the second pattern is greater than the area of the first pattern. Une carte de circuit imprimé souple selon un mode de réalisation comprend : un substrat comprenant une première surface et une seconde surface opposée à la première surface ; un premier motif de circuit et un second motif de circuit disposés sur la première surface ; et un motif métallique disposé sur la seconde surface, la seconde surface comprenant une pluralité de premières régions et une pluralité de secondes régions, un premier motif étant disposé dans les premières régions, un second motif étant disposé dans les secondes régions, et la zone du second motif étant supérieure à la zone du premier motif. 실시예에 따른 연성 회로기판은, 제 1 면 및 상기 제 1 면과 반대되는 제 2 면을 포함하는 기재; 상기 제 1 면 상에 배치되는 제 1 회로 패턴 및 제 2 회로 패턴; 및 상기 제 2 면 상에 배치되는 금속 패턴을 포함하고, 상기 제 2 면은 복수의 제 1 영역 및 복수의 제 2 영역을 포함하고, 상기 제 1 영역에는 제 1 패턴이 배치되고, 상기 제 2 영역에는 제 2 패턴이 배치되고, 상기 제 2 패턴의 면적은 상기 제 1 패턴의 면적보다 크다.