ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING ELECTRONIC PACKAGE
One embodiment of the present invention provides an electronic package and a method for manufacturing the electronic package, the electronic package comprising: a frame (1); a die (2); encapsulation materials (3); and a warpage prevention layer (4). One embodiment of the present invention provides a...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | English French Korean |
Published |
27.06.2024
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Subjects | |
Online Access | Get full text |
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Summary: | One embodiment of the present invention provides an electronic package and a method for manufacturing the electronic package, the electronic package comprising: a frame (1); a die (2); encapsulation materials (3); and a warpage prevention layer (4). One embodiment of the present invention provides an electronic package and a method for manufacturing the electronic package in which, by inserting the warpage prevention layer (4) inside the encapsulation materials, warpage of the package is reduced and heat dissipation and shielding properties are improved.
Un mode de réalisation de la présente invention concerne un boîtier électronique et un procédé de fabrication du boîtier électronique, le boîtier électronique comprenant : un bâti (1) ; une puce (2) ; des matériaux d'encapsulation (3) ; et une couche antigauchissement (4). Un mode de réalisation de la présente invention concerne un boîtier électronique et un procédé de fabrication du boîtier électronique dans lequel, en insérant la couche antigauchissement (4) à l'intérieur des matériaux d'encapsulation, le gauchissement du boîtier est réduit et les propriétés de dissipation de chaleur et de blindage sont améliorées.
본 발명의 일실시예는 프레임(1); 다이(2); 봉지재(3); 및 휨방지층(4);을 포함하는 전자 패키지 및 전자 패키지 제조방법을 제공한다. 본 발명의 일실시예는 봉지재의 내부에 휨방지층(4)을 삽입하여 패키지의 휨을 줄이고, 방열특성과 차폐특성을 개선하는 전자 패키지 및 전자 패키지 제조방법을 제공한다. |
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Bibliography: | Application Number: WO2023KR95108 |