WAFER DICING METHOD, DICING MACHINE, AND STORAGE MEDIUM

• Main Authors: LI, Changkun, NIU, Chengjie
• Format: Patent
• Language: Chinese; English; French
• Published: 27.06.2024
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

A wafer dicing method and a storage medium, which are applied to a dicing machine. The dicing machine dices a wafer (120) in a double-dicing mode, and in the double-dicing mode, the dicing machine uses two cutters to cut in sequence along a same dicing street (230). The method comprises: first, using a first cutter (210) to cut along a current dicing street (230) to form a first cutting mark; if before a second cutter (220) cuts along the current dicing street (230), cutting mark detection is performed and an offset between the first cutting mark and a preset cutting position of the current dicing street (230) is obtained, continuing to use the second cutter (220) to cut along the current dicing street (230), and ignoring the offset during the cutting process; and after the second cutter (220) completes cutting along the current dicing street (230), calibrating the cutting position of the next dicing street according to the offset. Also provided is a dicing machine. Thus, the secondary cutting process along a