RESIN COMPOSITION, PREPREG, RESIN-INCLUDING METAL SUBSTRATE, AND WIRING BOARD

• Main Author: KAMO, Hiromichi
• Format: Patent
• Language: English; French; Japanese
• Published: 13.06.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; COMPOUNDS THEREOF; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; INORGANIC CHEMISTRY; MAKING GRANULES OR PREFORMS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; NON-METALLIC ELEMENTS; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED; PRINTED CIRCUITS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

This resin composition comprises a resin and hollow silica particles, wherein the 20% burst pressure of the hollow silica particles as measured using the mercury intrusion method is not less than 120 MPa, or the electrostatic charge amount of the hollow silica particles is 0.005-0.080 μC/g. La composition de résine de l'invention contient une résine et des particules creuses de silice. Soit la pression d'éclatement à 20% des particules creuses de silice mesurée selon un procédé d'intrusion de mercure, est supérieure ou égale à １２０ＭＰａ, soit la quantité de charge électrique des particules creuses de silice est comprise entre ０,００５ et ０,０８０μＣ／ｇ. 本開示の樹脂組成物は、樹脂及び中空シリカ粒子を含み、水銀圧入法により測定される中空シリカ粒子の２０％破壊圧力が、１２０ＭＰａ以上であるか、又は、中空シリカ粒子の帯電量が０．００５～０．０８０μＣ／ｇである。