COMPOSITION FOR ADHESION ENHANCEMENT

• Main Authors: JUNG, Sung Mook, YOON, Dong Han, LEE, Su Yeon, CHOI, Young Min, KIM, Tae Su
• Format: Patent
• Language: English; French; Korean
• Published: 23.05.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; INKS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES; USE OF MATERIALS THEREFOR; WOODSTAINS

The present invention relates to a composition for adhesion enhancement and a metal-substrate bonding method using same. The composition for adhesion enhancement according to the present invention, for example, enables chemical bonding between metal particles and a polymer substrate to significantly enhance adhesive strength, and a metal laminate using same can be applied to a communication PCB with excellent performance. La présente invention concerne une composition pour l'amélioration de l'adhérence et un procédé de liaison de substrat métallique l'utilisant. La composition pour l'amélioration d'adhérence selon la présente invention, par exemple, permet une liaison chimique entre des particules métalliques et un substrat polymère pour améliorer significativement la force adhésive, et un stratifié métallique l'utilisant peut être appliqué à un PCB de communication ayant d'excellentes performances. 본 발명은 접착개선용 조성물 및 이를 이용하는 금속-기재의 결합방법에 관한 것으로, 본 발명에 따른 접착개선용 조성물은, 예를 들어, 금속입자와 고분자 기판을 화학적으로 결합시켜 접착력을 현저하게 향상시키며, 이를 이용하는 금속 적층체는 우수한 성능의 통신용 PCB로 적용될 수 있다.