BONDING PASTE, BONDED BODY, AND METHOD FOR PRODUCING BONDED BODY

• Main Authors: TANAKA Naohiro, UESUGI Takahiko
• Format: Patent
• Language: English; French; Japanese
• Published: 23.05.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASTING; CONDUCTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; PERFORMING OPERATIONS; POWDER METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; TRANSPORTING; WORKING METALLIC POWDER

The present invention addresses the problem of providing: a bonding paste which uses silver particles and enables pressureless bonding, while achieving excellent bonding strength and being suppressed in decrease of the bonding strength associated with temperature cycles; a bonded body which uses thi...