POGO PIN COOLING SYSTEM AND COOLING METHOD, AND ELECTRONIC COMPONENT TESTING DEVICE HAVING POGO PIN COOLING SYSTEM

• Main Authors: TSAI, I-ching, TSENG, I-shih, WU, Xin-yi, OU YANG, Chin-yi
• Format: Patent
• Language: Chinese; English; French
• Published: 02.05.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

A pogo pin cooling system and cooling method, and an electronic component testing device having the system, comprising a coolant circulation module (2). The coolant circulation module (2) comprises a coolant supply channel (21) and a coolant recovery channel (22) respectively communicated with slot inlets (Sin) and slot outlets (Sout) of a wafer slot (S). When the wafer slot (S) accommodates an electronic component (C), the coolant circulation module (2) supplies a coolant (Lc) into the wafer slot (S) by means of the coolant supply channel (21) and the slot inlets (Sin), and the coolant (Lc) flows through a pogo pin (Sp) and then flows back to the coolant recovery channel (22) through the slot outlets (Sout). The circularly-flowing coolant (Lc) can not only cool the pogo pin (Sp) in the wafer slot (S), but also cool the bottom surface of the electronic component (C) and a solder ball contact (Cb), to avoid a solder ball from contaminating the pogo pin (Sp) and the wafer slot (S) due to high-temperature soften