PROBES WITH PLANAR UNBIASED SPRING ELEMENTS FOR ELECTRONIC COMPONENT CONTACT

Probes for contacting electronic components include single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitudinal alignment of probes relative to array structures (e.g., ar...

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Bibliographic Details
Main Authors VEERAMANI, Arun S, SMALLEY, Dennis R
Format Patent
LanguageEnglish
French
Published 25.04.2024
Subjects
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Summary:Probes for contacting electronic components include single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitudinal alignment of probes relative to array structures (e.g., array substrates, guide plates) or other modules they contact or to which they adhere. Sondes pour la mise en contact de composants électroniques comprenant des modules élastiques uniques ou des paires de modules dos à dos qui peuvent partager une base commune. Les bases des modules peuvent comprendre des configurations qui permettent un alignement latéral et/ou longitudinal de sondes par rapport à des structures en réseau (par exemple des substrats en réseau, des plaques de guidage) ou d'autres modules avec lesquels elles entrent en contact ou auxquels elles adhèrent.
Bibliography:Application Number: WO2023US28700