CARD HAVING 3D PATTERN, AND MANUFACTURING METHOD THEREFOR

• Main Authors: NAM, Ki Sung, YANG, Jae Min, CHOI, Joung Hyun, JEONG, Young Hoon
• Format: Patent
• Language: English; French; Korean
• Published: 25.04.2024
• Subjects: CALCULATING; COLOUR PRINTING; COMPUTING; COUNTING; HANDLING RECORD CARRIERS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; LINING MACHINES; PERFORMING OPERATIONS; PHYSICS; PRESENTATION OF DATA; PRINTING; PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; RECOGNITION OF DATA; RECORD CARRIERS; STAMPS; TRANSPORTING; TYPEWRITERS

A method for manufacturing a card using a card manufacturing device according to an embodiment of the present invention, comprises the steps of: forming an adhesive layer on a body plate made of a metal material having a preset first surface roughness; carrying out vacuum deposition with a first base metal on the adhesive layer; and printing, using UV, a 3D pattern layer on the surface of the adhesive layer on which vacuum deposition has been carried out. Un procédé de fabrication d'une carte à l'aide d'un dispositif de fabrication de carte selon un mode de réalisation de la présente invention comprend les étapes consistant à : former une couche adhésive sur une plaque de corps constituée d'un matériau métallique ayant une première rugosité de surface prédéfinie ; effectuer un dépôt sous vide avec un premier métal de base sur la couche adhésive ; et imprimer, à l'aide d'UV, une couche de motif 3D sur la surface de la couche adhésive sur laquelle un dépôt sous vide a été réalisé. 본 발명의 실시 예에 따른 카드 제조 장치를 이용한 카드의 제조 방법은, 사전 설정된 제1 표면 조도를 갖는 메탈 소재로 구성된 몸체 플레이트상에 접착층을 형성하는 단계; 상기 접착층상에 제1 금속 베이스를 이용한 진공 증착 공정을 수행하는 단계; 및 상기 진공 증착 공정이 수행된 상기 접착층 표면에 UV를 이용한 3D 패턴층을 인쇄 가공하는 단계를 포함한다.