PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPACITOR, AND RELATED ELECTRONIC DEVICES AND FABRICATION METHODS

• Main Authors: KIM, Chin-Kwan, LANE, Ryan, PAYNTER, Charles David, XIE, Biancun, PANDEY, Shree Krishna
• Format: Patent
• Language: English; French
• Published: 28.03.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

Electronic devices that include a routing substrate with lower inductance path for a capacitor, and related fabrication methods. In exemplary aspects, to provide lower interconnect inductance for a capacitor coupled to a power distribution network in the routing substrate, an additional metal layer...