METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE, METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE, AND PEELING AND DISSOLVING COMPOSITION
The present invention provides: a method for cleaning a semiconductor substrate, by which it is possible to remove (clean), in a shorter time and more cleanly by a simple operation, an adhesive layer that is obtained using, for example, a siloxane-based adhesive, from a surface of the semiconductor...
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Main Authors | , |
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Format | Patent |
Language | English French Japanese |
Published |
21.03.2024
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Subjects | |
Online Access | Get full text |
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