METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE, METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE, AND PEELING AND DISSOLVING COMPOSITION

The present invention provides: a method for cleaning a semiconductor substrate, by which it is possible to remove (clean), in a shorter time and more cleanly by a simple operation, an adhesive layer that is obtained using, for example, a siloxane-based adhesive, from a surface of the semiconductor...

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Bibliographic Details
Main Authors SHINJO Tetsuya, YAGYU Masafumi
Format Patent
LanguageEnglish
French
Japanese
Published 21.03.2024
Subjects
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