RESIN COMPOSITION AND USE THEREOF

• Main Authors: JIN, Song, YUAN, Can, ZENG, Zhixiong, LIU, Chengjie, BAO, Xusheng, ZHOU, Huihui
• Format: Patent
• Language: Chinese; English; French
• Published: 21.03.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

Provided in embodiments of the present application is a resin composition, the resin composition comprising epoxy resin, a curing agent and an inorganic filler, wherein the cut-off particle size of the inorganic filler is 3 μm, and the inorganic filler has a D10 of 0.1 μm-0.4 μm, a D50 of 0.5 μm-1.1 μm and a D90 of 1.3 μm-2.9 μm. The resin composition has low viscosity and high fluidity and thus has a good narrow-gap-filling capability. Further provided in embodiments of the present application is the use of the resin composition. Des modes de réalisation de la présente invention concernent une composition de résine, la composition de résine comprenant une résine époxy, un agent de durcissement et une charge inorganique, la taille de particule de coupure de la charge inorganique étant de 3 µm, et la charge inorganique ayant un D10 de 0,1 µm à 0,4 µm, un D50 de 0,5 µm à 1,1 µm et un D90 de 1,3 µm à 2,9 µm. La composition de résine présente une faible viscosité et une fluidité élevée et présente ainsi une bonne