LOW DIELECTRIC RESIN COMPOSITION, ADHESIVENESS IMPARTING AGENT, LOW DIELECTRIC ADHESIVE COMPOSITION, LOW DIELECTRIC ADHESIVE MOLDED ARTICLE, LOW DIELECTRIC ADHESIVE AND MULTILAYER BODY

• Main Authors: SAKAMOTO, Natsuki, HIROTA, Yoshihito
• Format: Patent
• Language: English; French; Japanese
• Published: 22.02.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

This low dielectric resin composition contains a polyolefin resin. The polyolefin resin contains a styrene elastomer (A) and a cyclic olefin polymer (B) that has an alicyclic ring in the main chain. The content ratio of the styrene elastomer (A) is 30 parts by mass to 89 parts by mass relative to a total of 100 parts by mass of the styrene elastomer (A) and the cyclic olefin polymer (B). Cette composition de résine à faible diélectrique contient une résine polyoléfine. La résine polyoléfine contient un élastomère de styrène (A) et un polymère d'oléfine cyclique (B) qui présente un anneau alicyclique dans la chaîne principale. La teneur en élastomère de styrène (A) est de 30 parties en masse à 89 parties en masse par rapport à un total de 100 parties en masse d'élastomère de styrène (A) et de polymère d'oléfine cyclique (B). 低誘電性樹脂組成物が、ポリオレフィン系樹脂を含む。ポリオレフィン系樹脂が、スチレン系エラストマー（Ａ）と、主鎖に脂環を有する環状オレフィン系ポリマー（Ｂ）とを含有する。スチレン系エラストマー（Ａ）と環状オレフィン系ポリマー（Ｂ）との総量１００質量部に対して、スチレン系エラストマー（Ａ）の含有割合が、３０質量部以上８９質量部以下である。