ELASTIC RESIN COMPOSITION, AND RESIN FILM, RESIN-ATTACHED METAL FOIL, METAL-CLAD LAMINATED SHEET, WIRING BOARD AND CIRCUIT MOUNTED ARTICLE OBTAINED USING SAME

• Main Authors: SAWADA, Tomoaki, MICHIGAMI, Kyosuke
• Format: Patent
• Language: English; French; Japanese
• Published: 01.02.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

One aspect of the present invention relates to an elastic resin composition which contains a polyrotaxane (A), an epoxy resin (B) and a crosslinking agent (C). The crosslinking agent (C) contains an isocyanate compound which has two or more isocyanate groups, with the isocyanate groups being blocked by imidazole groups. Un aspect de la présente invention concerne une composition de résine élastique qui contient un polyrotaxane (A), une résine époxy (B) et un agent de réticulation (C). L'agent de réticulation (C) contient un composé isocyanate qui a deux groupes isocyanate ou plus, les groupes isocyanate étant bloqués par des groupes imidazole. 本発明の一局面は、ポリロタキサン（Ａ）と、エポキシ樹脂（Ｂ）と、架橋剤（Ｃ）とを含み、前記架橋剤（Ｃ）は、２つ以上のイソシアネート基を有し、且つ前記イソシアネート基がイミダゾール基によりブロック化されているイソシアネート化合物を含有する、伸縮性樹脂組成物に関する。